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Titanium-nitride self-encapsulation of Cu and Ag films on silicon dioxide

✍ Scribed by Daniel Adams; T Laursen; T.L Alford; J.W Mayer

Book ID: 114086235
Publisher: Elsevier Science
Year: 1997
Tongue: English
Weight: 195 KB
Volume: 308-309
Category: Article
ISSN: 0040-6090
DOI: 10.1016/s0040-6090(97)00502-6

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