Effects of film thickness and deposition rate on the diffusion barrier performance of titanium nitride in Cu-through silicon vias

✍ Scribed by Lee, Young-Joo; Yeon, Han-Wool; Jung, Sung-Yup; Na, Se-Kwon; Park, Jong-Seung; Choi, Yong-Yoon; Lee, Hoo-Jeong; Song, Oh-Sung; Joo, Young-Chang

• Book ID: 121564544
• Publisher: The Korean Institute of Metals and Materials
• Year: 2014
• Tongue: English
• Weight: 720 KB
• Volume: 10
• Category: Article
• ISSN: 1738-8090
• DOI: 10.1007/s13391-013-3108-0