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Through silicon vias filled with planarized carbon nanotube bundles

✍ Scribed by Wang, Teng; Jeppson, Kjell; Olofsson, Niklas; Campbell, Eleanor E B; Liu, Johan

Book ID: 120360407
Publisher: Institute of Physics
Year: 2009
Tongue: English
Weight: 810 KB
Volume: 20
Category: Article
ISSN: 0957-4484
DOI: 10.1088/0957-4484/20/48/485203

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