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Through-Silicon Vias Filled With Densified and Transferred Carbon Nanotube Forests

✍ Scribed by Teng Wang; Si Chen; Di Jiang; Yifeng Fu; Jeppson, K.; Lilei Ye; Johan Liu

Book ID: 119799680
Publisher: IEEE
Year: 2012
Tongue: English
Weight: 303 KB
Volume: 33
Category: Article
ISSN: 0741-3106
DOI: 10.1109/led.2011.2177804

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