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Three-dimensional wafer-scale copper chemical–mechanical planarization model

✍ Scribed by Dipto G. Thakurta; Donald W. Schwendeman; Ronald J. Gutmann; Sadasivan Shankar; Lei Jiang; William N. Gill


Book ID
108388418
Publisher
Elsevier Science
Year
2002
Tongue
English
Weight
687 KB
Volume
414
Category
Article
ISSN
0040-6090

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