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Three-dimensional electromagnetic analysis of shielded microstrip circuits

✍ Scribed by Hill, A. ;Burke, J. ;Kottapalli, K.

Publisher
John Wiley and Sons
Year
1992
Tongue
English
Weight
742 KB
Volume
2
Category
Article
ISSN
1050-1827

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✦ Synopsis

Abstract

The spectral domain integral equation approach is employed for the characterization of passive microstrip circuits that cannot be analyzed using the traditional lumped‐circuit‐based approach. General planar and certain three‐dimensional structures such as vias and air bridges are analyzed using the presented technique. Spurious mode coupling and the effect of the microwave housing on circuit performance are also investigated. Β© 1992 John Wiley & Sons, Inc.

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