Time-domain analysis of electromagnetic coupling of three-dimensional circuits involving through holes

✍ Scribed by Maeda, Shuji ;Kashiwa, Tatsuya ;Fukai, Ichiro

• Publisher: John Wiley and Sons
• Year: 1993
• Tongue: English
• Weight: 793 KB
• Volume: 3
• Category: Article
• ISSN: 1050-1827
• DOI: 10.1002/mmce.4570030415

✦ Synopsis

Abstract

Prediction of the mutual effects of the components involving through holes is essential for the design of multilayer circuits to operate at high frequencies. In this article, the characteristics of coupling between adjacent pairs of through holes and between a through hole and microstrip were analyzed using the finite‐difference time‐domain (FD‐TD) method. Numerical results in the time and frequency domains were compared with experimental results; these agreed well. Coupling coefficients were shown to depend on the orientation and distance of the microstrips or a through hole of the secondary from the primary through hole. The distribution of electric field intensity during through hole‐through hole coupling was also shown. The method described appears to hold great promise for substitution for the experimental process. © 1993 John Wiley & Sons, Inc.