Thin films of intermetallic Cu/Ti compounds and their possible uses

✍ Scribed by Tzanko Dimitrov Uzunov; Stojan Petrov Stojanov; Sashko Ivanov Lambov

• Publisher: Elsevier Science
• Year: 1999
• Tongue: English
• Weight: 740 KB
• Volume: 52
• Category: Article
• ISSN: 0042-207X
• DOI: 10.1016/s0042-207x(98)00312-1

✦ Synopsis

The technological regimes for the deposition of thin films of the intermetallic -Cu Ti and CuTi have been experimentally defined. The microhardness and corrosion resistance of the deposited films have been determined. It is experimentally proven that as a result of the intermetallic thin-films formation onto the Cu or Ti substrates the abrasive and corrosion resistance of the latter could be many times increased.