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Thin, Continuous, and Conformal Copper Films by Reduction of Atomic Layer Deposited Copper Nitride

✍ Scribed by Z. Li; R. G. Gordon

Publisher: John Wiley and Sons
Year: 2006
Tongue: English
Weight: 857 KB
Volume: 12
Category: Article
ISSN: 0948-1907
DOI: 10.1002/cvde.200606485

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