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Thickness effect on properties of titanium film deposited by d.c. magnetron sputtering and electron beam evaporation techniques

โœ Scribed by ARSHI, NISHAT; LU, JUNQING; LEE, CHAN GYU; YOON, JAE HONG; KOO, BON HEUN; AHMED, FAHEEM

Book ID
125377505
Publisher
Springer-Verlag
Year
2013
Tongue
English
Weight
698 KB
Volume
36
Category
Article
ISSN
0250-4707

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This paper addresses the influences of film thickness on structural and electrical properties of dc magnetron sputter-deposited copper (Cu) films on p-type silicon. Cu films with thicknesses of 130-1050 nm were deposited from Cu target at sputtering power of 125 W in argon ambient gas pressure of 3.