✦ LIBER ✦

Thermal Stress-Free Package for Flip-Chip Devices

✍ Scribed by Kohara, M.; Hatta, M.; Genjyo, H.; Shibata, H.; Nakata, H.

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

Thermal stress-free package for flip-chi

📂 Article 📅 1985 🏛 Elsevier Science 🌐 English ⚖ 253 KB

High Thermal Conduction Package Technolo

✍ Kohara, M.; Shin Nakao; Tsutsumi, K.; Shibata, H.; Nakata, H. 📂 Article 📅 1983 🏛 IEEE 🌐 English ⚖ 789 KB

Flip chip packaging for MEMS microphones

✍ Gregor Feiertag; Matthias Winter; Anton Leidl 📂 Article 📅 2010 🏛 Springer-Verlag 🌐 English ⚖ 423 KB

Reliability evaluations of flip chip pac

✍ Dae-Gon Kim; Jong-Woong Kim; Seung-Boo Jung 📂 Article 📅 2005 🏛 Elsevier Science 🌐 English ⚖ 388 KB

Copper pillar bump design optimization f

✍ K. M. Chen; T. S. Lin 📂 Article 📅 2009 🏛 Springer US 🌐 English ⚖ 597 KB

Singular stress fields at corners in fli

✍ Nanshu Lu; Zhen Zhang; Juil Yoon; Zhigang Suo 📂 Article 📅 2012 🏛 Elsevier Science 🌐 English ⚖ 497 KB