Thermal stress-free package for flip-chip devices : Masanobu Kohara, Muneo Hatta, Hideki Genjyo, Hiroshi Shibata and Hidefumi Nakata. IEEE Trans. Components Hybrids Mfg Technol. CHMT-7, 411 (1984)

• Book ID: 103279280
• Publisher: Elsevier Science
• Year: 1985
• Tongue: English
• Weight: 253 KB
• Volume: 25
• Category: Article
• ISSN: 0026-2714
• DOI: 10.1016/0026-2714(85)90605-5