High thermal conduction package technology for flip chip devices : Masanobu Kohara, Shin Nakao, Kazuhito Tsutsumi, Hiroshi Shibata and Hidefumi Nakata. IEEE Trans. Components Hybrids Mfg Technol.Chmt-6 (3), 267 (September 1983)

• Book ID: 103276872
• Publisher: Elsevier Science
• Year: 1984
• Tongue: English
• Weight: 266 KB
• Volume: 24
• Category: Article
• ISSN: 0026-2714
• DOI: 10.1016/0026-2714(84)90309-3