High thermal conduction package technology for flip chip devices: Masanobu Kohara, Shin Nakao, Kazuhito Tsutsumi, Hiroshi Shibata and Hidefumi Nakata IEEE Trans. Components Hybrids Mfg Technol. Chmt-6 (3), 267 (September 1983)

• Book ID: 108361401
• Publisher: Elsevier Science
• Year: 1986
• Tongue: English
• Weight: 94 KB
• Volume: 17
• Category: Article
• ISSN: 0026-2692
• DOI: 10.1016/s0026-2692(86)80023-4