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Thermal Stability Study of Cu(MoNx) Seed Layer on Barrierless Si

✍ Scribed by J.P. Chu; C.H. Lin; W.K. Leau; V.S. John

Book ID: 107455250
Publisher: Springer US
Year: 2008
Tongue: English
Weight: 650 KB
Volume: 38
Category: Article
ISSN: 0361-5235
DOI: 10.1007/s11664-008-0523-3

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