Looking onto application of low-k and ultra low-k materials within FEOL, high temperature load is one of the major challenges. But also temperature ranges below standard curing conditions are of special interest, e.g. for integration of transparent low-k materials into optical devices due to their s
โฆ LIBER โฆ
Thermal stability and gap-fill properties of spin-on MSQ low-k dielectrics
โ Scribed by N. Ahner; S.E. Schulz; F. Blaschta; M. Rennau
- Book ID
- 104051805
- Publisher
- Elsevier Science
- Year
- 2007
- Tongue
- English
- Weight
- 241 KB
- Volume
- 84
- Category
- Article
- ISSN
- 0167-9317
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