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Thermal resistance simulation of IC packages using a three-dimensional boundary element method : Toshiki Sota et al. Proceedings of the 22nd Symposium on Reliability and Maintainability, Tokyo, Japan. Union of Japanese Scientists and Engineers, 5 (June 1992)

Publisher: Elsevier Science
Year: 1993
Tongue: English
Weight: 112 KB
Volume: 33
Category: Article
ISSN: 0026-2714
DOI: 10.1016/0026-2714(93)90426-y

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