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Thermal properties of new bismaleimide resins containing hydrogen silsesquioxane and diallyl bisphenol A

✍ Scribed by Fuwei Huang; Farong Huang; Yan Zhou; Lei Du

Publisher
John Wiley and Sons
Year
2010
Tongue
English
Weight
448 KB
Volume
117
Category
Article
ISSN
0021-8995

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