𝔖 Bobbio Scriptorium
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Thermal Management Materials for High-Performance Applications

✍ Scribed by A. Luedtke

Publisher
John Wiley and Sons
Year
2004
Tongue
English
Weight
90 KB
Volume
6
Category
Article
ISSN
1438-1656

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✦ Synopsis

A main issue of the radio frequency power amplifier semiconductor components for base stations is the large amount of thermal energy created by the semiconductor. Packaging technology including heat dissipation is a critical element in nearly all new chip generations, caused by a power multiplication combined with a size reduction. This requires the use of special materials possessing both high thermal conductivity and a thermal expansion matching semiconductor materials like Si or GaAs as well as certain packaging ceramics.

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