A main issue of the radio frequency power amplifier semiconductor components for base stations is the large amount of thermal energy created by the semiconductor. Packaging technology including heat dissipation is a critical element in nearly all new chip generations, caused by a power multiplicatio
โฆ LIBER โฆ
The IRC in materials for high-performance applications
โ Scribed by Prof. Michael H. Loretto
- Publisher
- John Wiley and Sons
- Year
- 1995
- Tongue
- English
- Weight
- 496 KB
- Volume
- 7
- Category
- Article
- ISSN
- 0935-9648
No coin nor oath required. For personal study only.
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