๐”– Bobbio Scriptorium
โœฆ   LIBER   โœฆ

The IRC in materials for high-performance applications

โœ Scribed by Prof. Michael H. Loretto


Publisher
John Wiley and Sons
Year
1995
Tongue
English
Weight
496 KB
Volume
7
Category
Article
ISSN
0935-9648

No coin nor oath required. For personal study only.


๐Ÿ“œ SIMILAR VOLUMES


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โœ A. Luedtke ๐Ÿ“‚ Article ๐Ÿ“… 2004 ๐Ÿ› John Wiley and Sons ๐ŸŒ English โš– 90 KB ๐Ÿ‘ 1 views

A main issue of the radio frequency power amplifier semiconductor components for base stations is the large amount of thermal energy created by the semiconductor. Packaging technology including heat dissipation is a critical element in nearly all new chip generations, caused by a power multiplicatio

Hydroxyapatite/high-performance polyethy
โœ N. H. Ladizesky; I. M. Ward; W. Bonfield ๐Ÿ“‚ Article ๐Ÿ“… 1997 ๐Ÿ› John Wiley and Sons ๐ŸŒ English โš– 463 KB

A combination of three technologies, high-performance fiber processing, fiber compaction, and hydrostatic extrusion has been used to produce hydroxyapatite/ polyethylene bone analog composites with the highest stiffness and strength yet encountered in these systems, fully matching the values associa