✦ LIBER ✦

Thermal Issues in Next-Generation Integrated Circuits

✍ Scribed by Gurrum, S.P.; Suman, S.K.; Joshi, Y.K.; Fedorov, A.G.

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

Applications for GaAs and silicon integr

✍ Burns, L.M. 📂 Article 📅 1995 🏛 IEEE 🌐 English ⚖ 781 KB

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✍ Altet, J.; Rubio, A.; Schaub, E.; Dilhaire, S.; Claeys, W. 📂 Article 📅 2001 🏛 IEEE 🌐 English ⚖ 250 KB

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✍ Mehrotra, A.; Narayan, A.; Subramanian, R. 📂 Article 📅 2006 🏛 IEEE 🌐 English ⚖ 100 KB

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✍ Diaz, C.H.; Sung-Mo Kang; Duvvury, C. 📂 Article 📅 1994 🏛 IEEE 🌐 English ⚖ 816 KB

The Study on Integrated Network Architec

✍ Tang Xiaolin 📂 Article 📅 2011 🏛 Elsevier 🌐 English ⚖ 466 KB