✦ LIBER ✦

Simulation of electrical overstress thermal failures in integrated circuits

✍ Scribed by Diaz, C.H.; Sung-Mo Kang; Duvvury, C.

Book ID: 111882229
Publisher: IEEE
Year: 1994
Tongue: English
Weight: 816 KB
Volume: 41
Category: Article
ISSN: 0018-9383
DOI: 10.1109/16.275221

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

Simulating the Electrical Behavior of In

Simulating the Electrical Behavior of Integrated Circuit Devices in the Presence of Thermal Interactions

✍ Capobianchi, M.; Labay, V.; Fong Shi; Mizushima, G. 📂 Article 📅 2006 🏛 IEEE 🌐 English ⚖ 393 KB

Reliability assessment of CCDs operating

Reliability assessment of CCDs operating under ionizing radiation ambients: Failure — Simulation studies via electrical overstressing

✍ Samuel O. Agbo; Perambur S. Neelakanta; Lourdes M. Lay 📂 Article 📅 1992 🏛 Elsevier Science 🌐 English ⚖ 558 KB

[IEEE Proceedings of 17th Annual Electri

[IEEE Proceedings of 17th Annual Electrical Overstress/Electrostatic Discharge Symposium - Phoenix, AZ, USA (1995.09.12-1995.09.14)] Electrical Overstress/Electrostatic Discharge Symposium Proceedings - Transient-induced latchup testing of CMOS integrated circuits

✍ Weiss, G.H.; Young, D.E. 📂 Article 📅 1995 🏛 IEEE ⚖ 519 KB

Electrical characterization of analogue

Electrical characterization of analogue and RF integrated circuits by thermal measurements

✍ D. Mateo; J. Altet; E. Aldrete-Vidrio 📂 Article 📅 2007 🏛 Elsevier Science 🌐 English ⚖ 328 KB

Simulation of the thermal behaviour of t

Simulation of the thermal behaviour of thermal flow sensors by equivalent electrical circuits

✍ F.J. Auerbach; G. Meiendres; R. Müller; G.J.E. Scheller 📂 Article 📅 1994 🏛 Elsevier Science 🌐 English ⚖ 392 KB

The usage of eqmvalent electrical c~rcmts for the modellmg of thermal actlons allows the appllcatlon of standard network slmulatlon programs This paper shows the analogy between thermal and electrical problems It presents a method to handle the movmg medmm using a stationary electneal equwalent cncu

[IEEE 1993 IEEE International Symposium

[IEEE 1993 IEEE International Symposium on Circuits and Systems - Chicago, IL, USA (3-6 May 1993)] 1993 IEEE International Symposium on Circuits and Systems - Thermal failure simulation for electrical overstress in semiconductor devices

✍ Diaz, C.; Duvvury, C.; Kang, S.-M. 📂 Article 📅 1993 🏛 IEEE ⚖ 392 KB