Thermal interface material performance in microelectronics packaging applications

✍ Scribed by Seri Lee; Malcolm Early; Mark Pellilo

• Publisher: Elsevier Science
• Year: 1997
• Tongue: English
• Weight: 540 KB
• Volume: 28
• Category: Article
• ISSN: 0026-2692
• DOI: 10.1016/s0026-2692(97)87871-8

✦ Synopsis

The operation of near/y cvcvy electronic device generates heat, from the microprocessors used in computers, to mobile phone.Thc laws of physics dictate t/tat the performance and reliability of electronics and other integrated circuit dcvi,:es are absolutely constrained by device temperatures. Mathematicians have worked out formulae that indicate thatfor every 10°C vise in junction temperature the failure rate doubles. Petfovmance and reliability are jointly constrained by the manner in which electronic components are cooled and how the overall system attributes are handled. Heat is a major problem that ifleft unaddressed can cause problems at all stages of a product's l$e-cycle. Unless wejnd innovative ways to dissipate substantially move heat, there will be many move instances of equipmentfailure at a variety ofpoints in and around the enclosure and packaye --all of them temperature-related.