๐”– Bobbio Scriptorium
โœฆ   LIBER   โœฆ

Residual stresses in microelectronics induced by thermoset packaging materials during cure

โœ Scribed by Marcel H.H. Meuwissen; Hedzer A. de Boer; Henk L.A.H. Steijvers; Piet J.G. Schreurs; Marc G.D. Geers

Publisher
Elsevier Science
Year
2004
Tongue
English
Weight
469 KB
Volume
44
Category
Article
ISSN
0026-2714

No coin nor oath required. For personal study only.

๐Ÿ“œ SIMILAR VOLUMES

Direct Measurement of Cure-Induced Stres
Direct Measurement of Cure-Induced Stress in Thermosetting Materials by Means of a Dynamic Mechanical Analyzer
โœ Hong Yu; Subodh G. Mhaisalkar; Ee Hua Wong ๐Ÿ“‚ Article ๐Ÿ“… 2006 ๐Ÿ› John Wiley and Sons ๐ŸŒ English โš– 250 KB

## Abstract **Summary:** Significant stresses develop during cure in functional and structural applications of polymeric materials ranging from glass fiber composites to advanced functional polymers used in microelectronics, optoelectronics, and biomaterials applications. These stresses arise from