๐”– Bobbio Scriptorium
โœฆ   LIBER   โœฆ

Thermal Design of Electronic Circuit Boards and Packages

โœ Scribed by Keith Pitt

Publisher
Elsevier Science
Year
1987
Tongue
English
Weight
59 KB
Volume
18
Category
Article
ISSN
0026-2692

No coin nor oath required. For personal study only.

๐Ÿ“œ SIMILAR VOLUMES

Thermal design of electronic circuit boa
Thermal design of electronic circuit boards and packages: by D. J. Dean ISBN 901150 18 5 Price ยฃ63.00/$112.00 Pages-Approx. 400; Figures-131; References-73; Size-23ร—15 cm
๐Ÿ“‚ Article ๐Ÿ“… 1986 ๐Ÿ› Elsevier Science ๐ŸŒ English โš– 78 KB

Microelectronics packaging and interconnection technologies have undergone both evolutionary and revolutionary changes to serve the trend towards miniaturisation in electronic equipment, which is now very evident in military, telecommunications, industrial and consumer applications. The trend has be

Packaging design concept simulator for e
Packaging design concept simulator for electronic circuit
โœ Toosaku Kojima; Tazu Nomoto ๐Ÿ“‚ Article ๐Ÿ“… 2000 ๐Ÿ› John Wiley and Sons ๐ŸŒ English โš– 360 KB ๐Ÿ‘ 1 views

When designing a printed circuit board, details of the composition of packaging such as the numbers of layers and channels could not be easily determined; therefore, when the design process proceeded to designing a package, trialand-error processes were often repeated because of the indefinite numbe