Microelectronics packaging and interconnection technologies have undergone both evolutionary and revolutionary changes to serve the trend towards miniaturisation in electronic equipment, which is now very evident in military, telecommunications, industrial and consumer applications. The trend has been driven by various forces including specialist requirements for size and weight as well as cost and aesthetics, which have led to various innovative developments in packaging of integrated circuits and in connectivity on electronics substrates and circuit boards.
These technologies and their trends as well as the driving forces are described and examined in this book, which has been compiled with contributions from specialists actually engaged in research, development and the application of thin and thick film technologies, hybrid microcircuits, printed circuit boards and alternative substrates as well as microelectronics packaging, reliability and thermal design. A detailed coverage of the relevant hardware technologies, techniques and related aspects is included under the following chapter headings: Thin Film Technology; Thick Film Technology; Packaging Chips and Subcircuits; Hybrid Circuits; Microelectronics Reliability; Printed Circuit Boards, and Thermal Aspects of Microelectronics.
This comprehensive treatment of the subject should prove to be a valuable reference aid to engineers, technologists and managers involved in the design, manufacture, quality control, marketing and purchasing of electronic components and equipment.