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Thermal deformation measurement of the solder joints in electronic packages using electron moiré method

✍ Scribed by Xie Huimin; Satoshi Kishimoto; Norio Shinya; Dai Fulong; Zou Daqing; Liu Sheng

Book ID: 111200520
Publisher: John Wiley and Sons
Year: 1999
Tongue: English
Weight: 475 KB
Volume: 35
Category: Article
ISSN: 0039-2103
DOI: 10.1111/j.1475-1305.1999.tb01149.x

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