𝔖 Bobbio Scriptorium

✦ LIBER ✦

[IEEE EuroSimE 2005. 6th International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005. - Berlin, Germany (April 18-20, 2005)] EuroSimE 2005. Proceedings of the 6th International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005. - Thermal cycling simulation in electronic packages using molecular dynamic method

✍ Scribed by Fan, H.B.; Chan, E.K.L.; Wong, C.K.Y.; Yuen, M.M.F.

Book ID: 126695057
Publisher: IEEE
Year: 2005
Weight: 825 KB
Category: Article
ISBN-13: 9780780390621
DOI: 10.1109/ESIME.2005.1502768

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📜 SIMILAR VOLUMES

[IEEE EuroSimE 2005. 6th International C

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[IEEE EuroSimE 2005. 6th International C

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[IEEE EuroSimE 2005. 6th International C

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[IEEE EuroSimE 2005. 6th International C

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[IEEE EuroSimE 2005. 6th International C

[IEEE EuroSimE 2005. 6th International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005. - Berlin, Germany (April 18-20, 2005)] EuroSimE 2005. Proceedings of the 6th International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005. - Validation of FE modea for transient hot wire thermal conductivity measurements

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