𝔖 Bobbio Scriptorium

✦ LIBER ✦

[IEEE EuroSimE 2005. 6th International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005. - Berlin, Germany (April 18-20, 2005)] EuroSimE 2005. Proceedings of the 6th International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005. - Viscoelastic characterization of fast curing moulding compounds

✍ Scribed by Milosheva, B.V.; Jansen, K.M.B.; Janssen, J.H.J.; Bressers, H.J.L.; Ernst, L.J.

Book ID: 120295230
Publisher: IEEE
Year: 2005
Weight: 790 KB
Category: Article
ISBN-13: 9780780390621
DOI: 10.1109/ESIME.2005.1502849

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📜 SIMILAR VOLUMES

[IEEE EuroSimE 2005. 6th International C

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