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Thermal analysis of a substrate with power dissipation in the vias

✍ Scribed by Brewster, R.A.; Sherif, R.A.

Book ID: 114560363
Publisher: IEEE
Year: 1992
Tongue: English
Weight: 689 KB
Volume: 15
Category: Article
ISSN: 0148-6411
DOI: 10.1109/33.180029

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