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Signal Integrity Analysis of Package and Printed Circuit Board With Multiple Vias in Substrate of Layered Dielectrics

✍ Scribed by Boping Wu; Leung Tsang

Book ID: 118697325
Publisher: IEEE
Year: 2010
Tongue: English
Weight: 842 KB
Volume: 33
Category: Article
ISSN: 1521-3323
DOI: 10.1109/tadvp.2009.2026482

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