𝔖 Bobbio Scriptorium

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The ultrasonic bonding of silicon integrated circuit chips : Y. Gurler and K. C. Bingham, Proc. Tech. Programme, Int. Electron. Packaging Prod. Conf., Brighton, October 8–10 (1968), p. 137

Publisher: Elsevier Science
Year: 1969
Tongue: English
Weight: 99 KB
Volume: 8
Category: Article
ISSN: 0026-2714
DOI: 10.1016/0026-2714(69)90070-5

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