𝔖 Bobbio Scriptorium

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Handling and bonding of beam-lead sealed-junction integrated circuits : M. P. Eleftherion, Proc. Tech. Programme, Int. Electron Packaging Prod. Conf., Brighton, October 8–10 (1968), p. 123

Publisher: Elsevier Science
Year: 1969
Tongue: English
Weight: 214 KB
Volume: 8
Category: Article
ISSN: 0026-2714
DOI: 10.1016/0026-2714(69)90084-5

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