The study of mechanical properties of Sn–Ag–Cu lead-free solders with different Ag contents and Ni doping under different strain rates and temperatures

✍ Scribed by F.X. Che; W.H. Zhu; Edith S.W. Poh; X.W. Zhang; X.R. Zhang

• Book ID: 116607333
• Publisher: Elsevier Science
• Year: 2010
• Tongue: English
• Weight: 823 KB
• Volume: 507
• Category: Article
• ISSN: 0925-8388
• DOI: 10.1016/j.jallcom.2010.07.160