𝔖 Bobbio Scriptorium
✦   LIBER   ✦

Improvement on the microstructure stability, mechanical and wetting properties of Sn–Ag–Cu lead-free solder with the addition of rare earth elements

✍ Scribed by D.Q Yu; J Zhao; L Wang


Book ID
116597632
Publisher
Elsevier Science
Year
2004
Tongue
English
Weight
599 KB
Volume
376
Category
Article
ISSN
0925-8388

No coin nor oath required. For personal study only.


📜 SIMILAR VOLUMES