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The mechanical properties of freestanding electroplated Cu thin films

✍ Scribed by Xiang, Y. (author);Tsui, T. Y. (author);Vlassak, J. J. (author)

Book ID: 119958635
Publisher: Cambridge University Press
Year: 2006
Tongue: English
Weight: 436 KB
Volume: 21
Category: Article
ISSN: 0884-2914
DOI: 10.1557/JMR.2006.0195

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