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The many faces of absorptive capacity: spillovers of copper interconnect technology for semiconductor chips

✍ Scribed by Lim, K.

Book ID: 118167681
Publisher: Oxford University Press
Year: 2009
Tongue: English
Weight: 297 KB
Volume: 18
Category: Article
ISSN: 0960-6491
DOI: 10.1093/icc/dtp044

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