In the case of Fe-Ni-Cr alloys (without precipitation), we propose an electrochemical method which allows us to obtain a reproducible selective corrosion of grain boundaries (H,SO,-2N 25'C in the transpassive domain) . We establish a model of dissolution to explain the morphology of etched grooves .
The kinetics of grain boundary grooving in copper
โ Scribed by W.W. Mullins; P.G. Shewmon
- Publisher
- Elsevier Science
- Year
- 1959
- Weight
- 843 KB
- Volume
- 7
- Category
- Article
- ISSN
- 0001-6160
No coin nor oath required. For personal study only.
โฆ Synopsis
In an earlier paper the diffusion equation associated with grain boundary grooving was solved and it was concluded that surface diffusion was the dominant transport mechanism for copper.
For this mechanism the theory predicts that the shape of the groove profile has a time independent form and that the groove width and depth increase linearly with tlia. These two predictions have been tested by st,udying the grooving of tilt boundaries in copper annealed in dry hydrogen at 930ยฐC and 1035ยฐC. Both predictions agree with the experimental results. The validity of the theory allows one to calculate the surface diffusion coefficient, D,. The advantages of this method of determining D, are discussed. I,,\ CINETIQUE DC "CREUSEMENT" DE FRONTIERES DE GRAINS DANS LE CUIVRE Dans un article pr&c&dent, 1'6quation de diffusion associBe au "creusement" d'une frontibre de grain a &6 r&olue et on a conclu que la surface de diffusion 6tait le m&canisrne dominant de t,ransport, pour le ruivre. Pour ce m&anisme, la theorie prbdit que la forme du profil du sillon est independante du temps et que la largeur et la profondeur s'accroissent linbairement suivant t'14. Ces deux p&visions ont @tB v&if%es en Btudiant le creusement de front&es diversement orientbes dans du cuivre recuit, dam de l'hydrog8ne set b 930ยฐC et 1035ยฐC. Ces deux p&dictions sont en accord avec les r&+ultats expkrimentaux. La validit de la theorie permet de calculer les coefficients de diffusion superficielle, D,. Les auteurs discutent enfin les avantages de cette mPthode pour la determination de 11,. DIE KINETIK DER FURCHENBILDUNG AN KORNGRENZEN VON KUPFER In einer friiheren Arbeit wurde die Diffusionsgleichung, die mit der Furchenbildung an Korngrenzen verkniipft ist, gel&t und der Schluss gezogen, dass bei Kupfer die Oberfliichendiffusion der vorherrschende Transportmechanismus ist. Fiir diesen Mechanismus sagt die Theorie voraus, dass die Gestalt des Furchenprofils nicht van der Zeit abhiingt und dass die Breite und die Tiefe der Furchen linear mit t1/4 anwiichst Beide Voraussagen wurden gepriift durch eine Untersuchung der Furchenbildung an Neigungskomgrenzen van Kupfer, welches bei 930ยฐC und 1035ยฐC in trockenem Wasserstoff gegliiht worden war. Beide Voraussagen stimmen mit den experimentellen Befunden iiberein. Die Richtigkeit der Theorie ermbglicht die Berechnung des OberflBchendiffusionskoeffizienten D,. Die Vorteile diesel Bestimmungsmethode fi_ir D,$ werden erartert.
๐ SIMILAR VOLUMES
A numerical investigation of grain-boundary grooving by means of a level set method is carried out. An idealized polycrystalline interconnect which consists of grains separated by parallel grain boundaries aligned normal to the average orientation of the surface is considered. Initially, the surface
If it acquires a screw orientation, it will dissociate into partials and glide on an octahedral plane; if it acquires an edge orientation, it will dissociate into a barrier and become sessile. This reasoning is in agreement with the failures to observe slip on cube planes in highly favorable stress
When a solid-liquid interface is intersected by a grain boundary, a grain-boundary groove forms at the interface. Experiments have been carried out using camphene (a transparent analogue of a metal in terms of solidification behaviour) which show that, if the grain boundary is not perpendicular to t