In an earlier paper the diffusion equation associated with grain boundary grooving was solved and it was concluded that surface diffusion was the dominant transport mechanism for copper. For this mechanism the theory predicts that the shape of the groove profile has a time independent form and that
An interferometric study of grain boundary grooves in tin
โ Scribed by H Mykura
- Publisher
- Elsevier Science
- Year
- 1955
- Weight
- 903 KB
- Volume
- 3
- Category
- Article
- ISSN
- 0001-6160
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