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The kinetics and mechanism of room-temperature microstructural evolution in electroplated copper foils

✍ Scribed by K.B. Yin; Y.D. Xia; C.Y. Chan; W.Q. Zhang; Q.J. Wang; X.N. Zhao; A.D. Li; Z.G. Liu; M.W. Bayes; K.W. Yee

Book ID: 113896943
Publisher: Elsevier Science
Year: 2008
Tongue: English
Weight: 530 KB
Volume: 58
Category: Article
ISSN: 1359-6462
DOI: 10.1016/j.scriptamat.2007.08.028

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