The investigation of creep of electroplated Sn and Ni–Sn coating on copper at room temperature by nanoindentation

✍ Scribed by Jinju Chen; S.J. Bull

• Publisher: Elsevier Science
• Year: 2009
• Tongue: English
• Weight: 740 KB
• Volume: 203
• Category: Article
• ISSN: 0257-8972
• DOI: 10.1016/j.surfcoat.2008.12.007