The joint strength and microstructure of fluxless Au/Sn solders in InP-based laser diode packages

✍ Scribed by M. T. Sheen; Y. H. Ho; C. L. Wang; K. C. Hsieh; W. H. Cheng

• Publisher: Springer US
• Year: 2005
• Tongue: English
• Weight: 197 KB
• Volume: 34
• Category: Article
• ISSN: 0361-5235
• DOI: 10.1007/s11664-005-0257-4