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The influence of thermal aging on joint strength and fracture surface of Pb/Sn and Au/Sn solders in laser diode packages

✍ Scribed by M. T. Sheen; C. M. Chang; H. C. Teng; J. H. Kuang; K. C. Hsieh; W. H. Cheng

No coin nor oath required. For personal study only.

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