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The Influence of TiN Thickness and Formation Method on the Structural and Electrical Properties of Gate Stacks

✍ Scribed by Vellianitis, G.; van Dal, M.J.H.; Boccardi, G.; Duriez, B.; Voogt, F.C.; Kaiser, M.; Witters, L.; Lander, R.J.P.

Book ID
118698614
Publisher
IEEE
Year
2009
Tongue
English
Weight
412 KB
Volume
56
Category
Article
ISSN
0018-9383

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