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The influence of stacking faults on the thermal conductivity of rutile

โœ Scribed by A.J.H. Mante; J. Volger


Publisher
Elsevier Science
Year
1970
Weight
957 KB
Volume
49
Category
Article
ISSN
0031-8914

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โœ C. Schmidt ๐Ÿ“‚ Article ๐Ÿ“… 1975 ๐Ÿ› Elsevier Science ๐ŸŒ English โš– 364 KB

The thermal conductivity of epoxy resins filled with copper powder was measured as a function of grain size and filler concentration between 1.5 and 20 K. In addition, the thermal boundary layer resistance (Kapitza resistance) between epoxy resin and copper was measured. As a consequence of this res