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Influence of the Kapitza resistance on the thermal conductivity of filled epoxies

✍ Scribed by C. Schmidt


Publisher
Elsevier Science
Year
1975
Tongue
English
Weight
364 KB
Volume
15
Category
Article
ISSN
0011-2275

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✦ Synopsis


The thermal conductivity of epoxy resins filled with copper powder was measured as a function of grain size and filler concentration between 1.5 and 20 K. In addition, the thermal boundary layer resistance (Kapitza resistance) between epoxy resin and copper was measured. As a consequence of this resistance the thermal conductivity is strongly dependent on grain size in the lower temperature range. Below a characteristic temperature dependent on grain size, thermal conductivity is reduced by adding filler. A simple formula is presented for calculation of the thermal conductivity of filled resins.


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