## Abstract To improve the thermal conductivity of BNβfilled epoxy composite, admicellar polymerization was used to coat polystyrene and polymethyl methacrylate on the BN surface to improve the interfacial adhesion in the composite. The treated surface was characterized by FTIR and contact angle me
Influence of the Kapitza resistance on the thermal conductivity of filled epoxies
β Scribed by C. Schmidt
- Publisher
- Elsevier Science
- Year
- 1975
- Tongue
- English
- Weight
- 364 KB
- Volume
- 15
- Category
- Article
- ISSN
- 0011-2275
No coin nor oath required. For personal study only.
β¦ Synopsis
The thermal conductivity of epoxy resins filled with copper powder was measured as a function of grain size and filler concentration between 1.5 and 20 K. In addition, the thermal boundary layer resistance (Kapitza resistance) between epoxy resin and copper was measured. As a consequence of this resistance the thermal conductivity is strongly dependent on grain size in the lower temperature range. Below a characteristic temperature dependent on grain size, thermal conductivity is reduced by adding filler. A simple formula is presented for calculation of the thermal conductivity of filled resins.
π SIMILAR VOLUMES
A structural epoxy-based adhesive cured with dicyandiamide (DDA) and 4,4Π diaminodiphenylsulphone (DDS) has been aged at elevated temperatures under various gaseous environments. Weight loss was accompanied by enrichment of oxygen, sulfur, and nitrogen, near the polymeric surface, after aging in oxy
Having in mind to produce electrically conductive carbon-epoxy composite materials, we have filled an insulating epoxy resin with an electronic conducting polymer, polypyrrole (PPy). To select the PPy that best suits this process, various PPys were chemically synthesized. The syntheses were performe