𝔖 Bobbio Scriptorium
✦   LIBER   ✦

Influence of the gaseous environment on the thermal degradation of a structural epoxy adhesive

✍ Scribed by X. Buch; M. E. R. Shanahan


Publisher
John Wiley and Sons
Year
2000
Tongue
English
Weight
120 KB
Volume
76
Category
Article
ISSN
0021-8995

No coin nor oath required. For personal study only.

✦ Synopsis


A structural epoxy-based adhesive cured with dicyandiamide (DDA) and 4,4Ј diaminodiphenylsulphone (DDS) has been aged at elevated temperatures under various gaseous environments. Weight loss was accompanied by enrichment of oxygen, sulfur, and nitrogen, near the polymeric surface, after aging in oxygen containing atmospheres, as shown by X-ray analysis. Sulfur dioxide was detected in the aging environment. Results strongly suggest chain scission by thermolysis combined with thermo-oxidative degradation occurring near the exposed surface.


πŸ“œ SIMILAR VOLUMES


Influence of the Kapitza resistance on t
✍ C. Schmidt πŸ“‚ Article πŸ“… 1975 πŸ› Elsevier Science 🌐 English βš– 364 KB

The thermal conductivity of epoxy resins filled with copper powder was measured as a function of grain size and filler concentration between 1.5 and 20 K. In addition, the thermal boundary layer resistance (Kapitza resistance) between epoxy resin and copper was measured. As a consequence of this res

Thermal degradation of polyimidesβ€”I. Inv
✍ J. Zurakowska-Orszagh; T. Chreptowicz; A. Orzeszko; J. Kaminski πŸ“‚ Article πŸ“… 1979 πŸ› Elsevier Science 🌐 English βš– 236 KB

The structures of isoimide cycles in polyimides were elucidated from i.r. and 13C NMR spectra of N-phenylphthalimide and N-phenylphthalisoimide. Using i.r. and gas-chromatographic data, conversion of isoimide cycles to the imide form was studied as a function of temperature. This process is irrevers