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The influence of copper nanopowders on microstructure and hardness of lead–tin solder

✍ Scribed by D Lin; G.X Wang; T.S Srivatsan; Meslet Al-Hajri; M Petraroli

Book ID
117356616
Publisher
Elsevier Science
Year
2002
Tongue
English
Weight
588 KB
Volume
53
Category
Article
ISSN
0167-577X

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This paper describes the consolidation of copper powders by the technique of plasma pressure compaction. Microstructural observations and density measurements provide evidence of the presence of residual porosity even after consolidation at 820 ЊC. Vicker's microhardness measurements revealed the sa