✦ LIBER ✦
Understanding the Influence of Copper Nanoparticles on Thermal Characteristics and Microstructural Development of a Tin-Silver Solder
✍ Scribed by D.C. Lin; T.S. Srivatsan; G-X. Wang; R. Kovacevic
- Publisher
- Springer US
- Year
- 2007
- Tongue
- English
- Weight
- 791 KB
- Volume
- 16
- Category
- Article
- ISSN
- 1059-9495
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