The impact of packaging on the reliability of flip-chip solder bonded devices : Kevin J. Lodge and David J. Pedder. IEEE Trans. Compon. Hybrids mfg Technol.13(4), 847 (1990)

• Publisher: Elsevier Science
• Year: 1991
• Tongue: English
• Weight: 128 KB
• Volume: 31
• Category: Article
• ISSN: 0026-2714
• DOI: 10.1016/0026-2714(91)90140-3