๐”– Bobbio Scriptorium
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The impact of packaging on the reliability of flip-chip solder bonded devices : Kevin J. Lodge and David J. Pedder. IEEE Trans. Compon. Hybrids mfg Technol.13(4), 847 (1990)


Publisher
Elsevier Science
Year
1991
Tongue
English
Weight
128 KB
Volume
31
Category
Article
ISSN
0026-2714

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